MicroLine 300關(guān)鍵尺寸的自動(dòng)化光學(xué)測量系統(tǒng)

MicroLineTM 300是一款高性能測量晶圓、光罩、MEMS和其他微加工設(shè)備等關(guān)鍵尺寸的自動(dòng)化測量系統(tǒng)。該系統(tǒng)配備了高質(zhì)量光學(xué)顯微鏡和精密移動(dòng)平臺(tái)，可對200mm的晶圓上0.5μm到400μm的特征尺寸進(jìn)行全自動(dòng)的精密視場測量。

•  200 x 200mm精密X-Y平臺(tái)

•  基于視覺的自動(dòng)聚焦獲得*佳影像質(zhì)量

•  自動(dòng)照明可編程光強(qiáng)

•  用于測量透明層、不規(guī)則邊緣的線、厚膜等的強(qiáng)勁性能

•  完全可編程的序列，包括自動(dòng)聚焦和關(guān)鍵尺寸測量

•  電動(dòng)的6目物鏡轉(zhuǎn)換器，軟件控制

•  可選的透射照明

技術(shù)規(guī)格：
- 測量行程: 200 x 200 x 25mm (XYZ)
- 平臺(tái)運(yùn)行: 交叉滾軸手動(dòng)同軸定位和快速釋放
- 視場內(nèi)的測量精度: 0.010μm (用100x物鏡)
- 特征尺寸: 視場內(nèi)0.5μm - 400μm
- FOV測量重復(fù)性:<0.010μm on wafers (用100x物鏡)
<0.005μm on photomasks (用100x物鏡)
- 照明: 石英鹵素?zé)? 反射光
自動(dòng)照明
- 低噪音CCD VGA格式攝像頭
- 圖像處理60幀每秒
MicroLine 300的典型應(yīng)用包括：

•  晶圓

•  光罩

•  MEMS

•  微型組件

測量類型:

•  關(guān)鍵尺寸:

           線寬 Linewidth
           節(jié)距 Pitch
           間隙 Spacing

•  Overlay

           Multi-layer registration
           Box in box
           Circle
           Edge roughness
           Butting error

美國進(jìn)口 VIEW MicroLine 300 桌上型半自動(dòng)CD測量系統(tǒng) 

美國進(jìn)口 VIEW MicroLine 300 桌上型半自動(dòng)CD測量系統(tǒng) 

MicroLine 300
Automated Optical Critical Dimension Metrology System

The MicroLineTM 300 is a high-performance Critical Dimension Measurement System for wafers, masks, MEMS, and other micro-fabricated devices. This capable instrument provides precise automated field-of-view measurement of features ranging in size from 0.5μm to 400μm on wafers up to 200mm.

•  200 x 200mm Precision X-Y stage

•  Vision-based autofocus for Optimum image quality

•  Autoillumination Programmable light intensity

•  Robust capacities for measuring transparent Layers, lines with irregular edges, thick films and more

•  Fully Programmable Sequences including autofocus and Critical Dimension Measurement

•  Motorized 6-Objective nosepiece with software control

•  Optional transmitted illumination 

Technical Specification
- Stage Travel: 200 x 200 x 25mm (XYZ)
- Stage Type: crossed-roller with manual co-axial positioning and quick release
- Measurement Accuracy in the field of view: 0.010μm (with 100x objective lens)
- Feature size: 0.5μm - 400μm within the field of view
- FOV Measurement repeatability:<0.010μm on wafers (with 100x objective lens)
<0.005μm on photomasks (with 100x objective lens)
- Illumination: Quartz-halogen, reflected light
Autoillumination
- Low-noise CCD VGA format camera
- Image processing at 60 frames per second
Typical Applications for MicroLine 300 include:

•  Wafers

•  Photomasks 

•  MEMS

•  Micro-scale components

Measurement Types:

•  Critical Dimensions:

               Linewidth
               Pitch
               Spacing

•  Overlay

             Multi-layer registration
             Box in box
             Circle
             Edge roughness
             Butting error